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Energy-Aware Design and Performance Analysis of Through-Oxide Thermal Vias (TOTVs) via Finite Element Analysis and Driven Optimization

Cheng-Chi Wang, Yeong-Jyh Lin, Jiří Ryšavý, Jakub Čespiva, Masahide Oshima, Chia-Hung Lai

2026, 3(1): 12-28. doi: 10.53941/gefr.2026.100002

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