2606004203
  • Open Access
  • Article

Process for Preparing Molybdenum-Silicon Alloy Targets

  • Xuejia Gu 1, 2, 3,   
  • Ning Fan 1, 2,   
  • Zhaochong Ding 1, 2,   
  • Qian Jia 1, 2,   
  • Yutong Ran 1, 2, *,   
  • Jinjiang He 1, 2, *

Received: 28 Apr 2026 | Revised: 08 Jun 2026 | Accepted: 10 Jun 2026 | Published: 26 Jun 2026

Abstract

With the development of emerging fields such as big data, artificial intelligence, and 5G communication, the critical dimensions of integrated circuits are constantly shrinking. As a high-precision tool used for pattern transfer in the lithography process, the quality of photomasks directly determines the final performance of circuits. Molybdenum silicide alloys with high silicon content have become key materials for the light-absorbing film layer in advanced photomasks due to their excellent properties such as optical tunability, ease of etching, chemical resistance, and radiation resistance. The quality of the film is highly dependent on the magnetron sputtering target material, and the development of high-uniformity and high-density molybdenum silicide alloy targets is of crucial importance. Traditional powder metallurgy methods for producing Mo-Si targets often yield compositional inhomogeneities, coarse grain structures, and cracking due to density differences between Mo and Si phases and the exothermic reaction between molybdenum and silicon. This poses significant challenges in target fabrication. This study proposes a systemic “powder pre-alloying + hot-press sintering” process. Using a mixed powder with a molybdenum-silicon atomic ratio of 1:9 as raw material, systematically investigating the effect of heat treatment temperature on molybdenum-silicon alloying. The optimal temperature was determined to be 1350 °C  with a 2-h soak. The phase evolution sequence during the molybdenum-silicon reaction was elucidated as Mo + Si → Mo3Si + Si → Mo5Si3 + Si → MoSi2. Further investigations revealed that the resulting Si-MoSi2 alloy powder exhibits brittle-brittle system characteristics. Mechanical ball milling continuously refines the particles, increasing the surface energy and density of microdefects in the powder, which helps improve the powder’s sintering activity, enabling the successful production of molybdenum-silicon targets with a relative density no less than 99% and markedly improved microstructural uniformity.

References 

  • 1.

    Pratap, S.; Jauhar, S.K.; Gunasekaran, A.; et al. Optimizing the IoT and Big Data Embedded Smart Supply Chains for Sustainable Performance. Comput. Ind. Eng. 2024, 187, 109828.

  • 2.

    Li, S. Analysis of the Prospect of New Energy and Low-Altitude Economy Industry Combination under the Background of Low-Carbon Economy. Acad. J. Bus. Manag. 2024, 6, 179–183.

  • 3.

    French, R.H.; Tran, H.V. Immersion Lithography: Photomask and Wafer-Level Materials. Annu. Rev. Mater. Res. 2009, 39, 93–126.

  • 4.

    Cao, K.W.; Wu, Y.R.; Zhang, J.H.; et al. Current Status and Development Direction of Mask Standards. Stand. Sci. 2022, S1, 91–95. https://doi.org/10.3969/j.issn.1674-5698.2022.z1.016. (In Chinese)

  • 5.

    Osipov, A.A.; Gagaeva, A.E.; Speshilova, A.B.; et al. Development of Controlled Nanosphere Lithography Technology. Sci. Rep. 2023, 13, 3350.

  • 6.

    Shapiro, S.; Tan, S.K.; Maeng, J.Y.; et al. Application of KrF PSM in ArF Photolithography Processing. In Proceedings of SPIE Photomask Technology and Extreme Ultraviolet Lithography, Monterey, CA, USA, 29 September–3 October 2024; pp. 517–528.

  • 7.

    Zhang, S.J.; Shen, M.H.; Xu, Y.; et al. Performance Comparison between Attenuated PSM and Opaque MoSi on Glass (OMOG) Mask in Sub-32 nm Litho Process. ECS Trans. 2012, 44, 249–256.

  • 8.

    Carcia, P.F.; French, R.H.; Sharp, K.G.; et al. Materials Screening for Attenuating Embedded Phase-Shift Photoblanks for DUV and 193-nm Photolithography. In Proceedings of the 16th Annual BACUS Symposium on Photomask Technology and Management, Redwood City, CA, USA, 18–20 September 1996; pp. 255–263.

  • 9.

    Wu, Q.; Hu, H.Y.; He, W.M.; et al. Photolithography Process Near the Diffraction Limit; Tsinghua University Press: Beijing, China, 2020; pp. 285–290. (In Chinese)

  • 10.

    Ji, P. Simulation of Plasma Property Distribution and Sputtering Characteristics of Targets in Magnetron Sputtering. Masterʼs Thesis, Xiʼan University of Technology, Xiʼan, China, 2024. (In Chinese)

  • 11.

    He, J.J.; He, X.; Xiong, X.D.; et al. Research Status of High Purity Metals and High Performance Sputtering Target Used in Integrated Circuit. Adv. Mater. Ind. 2015, 17, 47–52. (In Chinese)

  • 12.

    Jia, G.B.; Feng, Y.N.; Jia, Y. Manufacture, Application and Development of Refractory Metal Target Used on Magnetron Sputtering. Met. Funct. Mater. 2016, 23, 48–52. (In Chinese)

  • 13.

    Li, J.; Fu, Z.; Wei, L.; et al. Characterization of Mo-6Ta Alloy Targets and Its Magnetron Sputtering Deposited Thin Film. Int. J. Refract. Met. Hard Mater. 2022, 103, 105770.

  • 14.

    Huang, Z.M.; Wang, D.Z.; Wu, Z.Z.; et al. Preparation Technology of Tungsten Silicide Alloys Used for Sputtering Target. Powder Metall. Technol. 2021, 39, 445–451. (In Chinese)

  • 15.

    Peng, X.M.; Xia, C.Q.; Liu, Y.Y.; et al. Surface Molybdenizing on Titanium by Halide-Activated Pack Cementation. Surf. Coat. Technol. 2009, 203, 3306–3311.

  • 16.

    Honma, T.; Tatami, J. Effects of Molybdenum Volume Fraction and Silica Molybdenum Particle-Size Ratio on Relative Bulk Density and Electrical Conductivity of Silica-Molybdenum Composites Fabricated by Spark Plasma Sintering. J. Mater. Sci. 2014, 49, 5878–5884.

  • 17.

    Lambert, D.S.; Lennon, A.; Burr, P.A. Diffusion Mechanisms of Mo Contamination in Si. Phys. Rev. Mater. 2020, 4, 025403.

  • 18.

    Qiu, M.F.; Cui, C.X.; Li, Y.; et al. Microscopic Mechanism for the Interfacial Diffusion in Mo/Si Multilayers from Molecular Dynamics Simulations. J. Mater. Eng. Perform. 2026, 35, 4797–4807.

  • 19.

    Liang, Y.J.; Che, Y.C. Handbook of Thermodynamic Data for Inorganic Compounds; Northeast University Press: Shenyang, China, 1993; p. 466. (In Chinese)

  • 20.

    Deevi, S.C. Self-Propagating High-Temperature Synthesis of Molybdenum Disilicide. J. Mater. Sci. 1991, 26, 3343–3353. https://doi.org/10.1007/bf01124683.

  • 21.

    Sameezadeh, M.; Farhangi, H.; Emamy, M. Structural and Morphological Evaluation of Nano-Sized MoSi2 Powder Produced by Mechanical Milling. Int. J. Mod. Phys. Conf. Ser. 2012, 5, 464–471.

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Gu, X.; Fan, N.; Ding, Z.; Jia, Q.; Ran, Y.; He, J. Process for Preparing Molybdenum-Silicon Alloy Targets. Low-Dimensional Materials 2026, 2 (2), 4. https://doi.org/10.53941/ldm.2026.100004.
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